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Wafer
Our wafer is produced by the directional solidification system and multi-line cutting machine.
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Quality Assurance andPackaging
We do full inspection (manual andautomatic) and random inspection for every batch of wafers and record theresults into ERP system. We ensure that our products are 100% traceable. Theproducts will be packaged in carton box with polyfoam and sealed with plastic(100 pieces in a box, 12 boxes in a case).
| Parameter | Value | Unit |
| Material type | Multi-crystalline Silicon/Casting | |
| Geometry | Square wafer | |
| Conductivity type | P-type | |
| Dimension | 156x156±0.5 | mm |
| Cornor | 2.0±0.5 | mm |
| Dopant | B | |
| Resistivity | 1.0-3.0 | Ω-cm |
| Oxygen content | ≤5.0E17 | atom/cm3 |
| Carbon content | ≤1.0E18 | atom/cm3 |
| Life time | ≥2 | μs |
| Square angle | 90±0.5 | degree |
| Thickness | 200±20 | μm |
| TTV | ≤30 | μm |
| Bow/Warp | ≤75 | μm |
| Surface | As-cut,cleaned | |
| Surface | Saw mark≤15 | μm |