Wafer
Our wafer is produced by the directional solidification system and multi-line cutting machine.
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Our wafer is produced by the directional solidification system and multi-line cutting machine.
Quality Assurance andPackaging
We do full inspection (manual andautomatic) and random inspection for every batch of wafers and record theresults into ERP system. We ensure that our products are 100% traceable. Theproducts will be packaged in carton box with polyfoam and sealed with plastic(100 pieces in a box, 12 boxes in a case).
Parameter | Value | Unit |
Material type | Multi-crystalline Silicon/Casting | |
Geometry | Square wafer | |
Conductivity type | P-type | |
Dimension | 156x156±0.5 | mm |
Cornor | 2.0±0.5 | mm |
Dopant | B | |
Resistivity | 1.0-3.0 | Ω-cm |
Oxygen content | ≤5.0E17 | atom/cm3 |
Carbon content | ≤1.0E18 | atom/cm3 |
Life time | ≥2 | μs |
Square angle | 90±0.5 | degree |
Thickness | 200±20 | μm |
TTV | ≤30 | μm |
Bow/Warp | ≤75 | μm |
Surface | As-cut,cleaned | |
Surface | Saw mark≤15 | μm |