DAQO GROUP



Wafer

Our wafer is produced by the directional solidification system and multi-line cutting machine.

Quality Assurance andPackaging

We do full inspection (manual andautomatic) and random inspection for every batch of wafers and record theresults into ERP system. We ensure that our products are 100% traceable. Theproducts will be packaged in carton box with polyfoam and sealed with plastic(100 pieces in a box, 12 boxes in a case). 

ParameterValueUnit
Material typeMulti-crystalline Silicon/Casting 
GeometrySquare wafer 
Conductivity typeP-type 
Dimension156x156±0.5mm
Cornor2.0±0.5mm
DopantB 
Resistivity1.0-3.0Ω-cm
Oxygen content≤5.0E17atom/cm3
Carbon content≤1.0E18atom/cm3
Life time≥2μs
Square angle90±0.5degree
Thickness200±20μm
TTV≤30μm
Bow/Warp≤75μm
SurfaceAs-cut,cleaned 
SurfaceSaw mark≤15μm

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